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Tag: SoCs

  • Dirac and MediaTek Partner to Advance In-Car Audio Experiences Through Integrated Automotive Systems-on-Chips

    Dirac and MediaTek Partner to Advance In-Car Audio Experiences Through Integrated Automotive Systems-on-Chips

    Dirac has teamed up with global semiconductor leader MediaTek to enhance in-car audio by integrating Dirac’s advanced audio software into MediaTek’s automotive-grade chips. This partnership aims to help car manufacturers deliver high-quality, immersive sound more efficiently by reducing the need for complex hardware and simplifying system integration. The companies will showcase their initial collaboration at Auto Shanghai 2025, focusing first on MediaTek’s HiFi 5 DSPs in its Dimensity Auto Cockpit chipsets.

    This move highlights the growing trend of software-defined audio systems in vehicles, offering OEMs faster time-to-market and scalable solutions. With Dirac already trusted by brands like Volvo and BYD, the partnership with MediaTek strengthens its reach in the automotive tech space, delivering next-gen cabin audio experiences that meet the rising consumer demand for premium in-car sound.

    Swedish digital audio pioneer Dirac and global semiconductor leader MediaTek today announced a strategic collaboration to enhance in-car audio performance through the integration of Dirac’s industry-leading digital audio software into MediaTek’s automotive-grade systems-on-chips (SoCs).

    The companies have signed a Memorandum of Understanding (MoU) to co-develop a proof of concept that integrates Dirac’s advanced audio optimization technologies directly onto MediaTek’s automotive platforms – enabling OEMs to deliver superior in-car sound quality with easier system integration and accelerated time-to-market.

    “This collaboration with MediaTek is a key milestone in Dirac’s ongoing expansion in the automotive sector,” said Ramzi Khalaf, Director of Strategic Partnerships, Dirac. “By combining MediaTek’s powerful, energy-efficient chipsets with our proprietary audio technologies, we’re raising the bar for automotive sound performance. This partnership not only strengthens our global reach – it also reflects our commitment to future-ready hardware platforms that simplify integration and accelerate time to market for our customers.”

    The initial phase of the collaboration focuses on integrating Dirac’s digital audio technologies into the HiFi 5 DSPs, featured in the MediaTek Dimensity Auto Cockpit chipsets designed for automotive applications. The companies will both attend the Auto Shanghai 2025, taking place April 25–May 2. This initiative marks the beginning of a broader, long-term strategic partnership.

    As consumers increasingly expect high-fidelity, immersive sound inside vehicles—on par with premium home audio systems – automotive manufacturers are turning to software-defined solutions. Dirac is at the forefront of this shift, delivering technologies that maximize speaker performance and create consistent, high-quality sound for every seat in the cabin.

    Dirac is an established leader in the automotive market, working with leading brands such as Volvo, Polestar, Genesis, NIO, and BYD, among many others. In recent years, Dirac has accelerated its automotive industry growth through partnerships with semiconductor and framework companies like NXP, Analog Devices, QNX, Black Sesame Technologies, and now MediaTek. With this agreement, Dirac continues to expand its footprint, making its solutions more accessible to OEMs worldwide.

    MediaTek is a global innovator in SoC design, delivering high-performance, power-efficient semiconductors across automotive, mobile, home entertainment, and IoT. Its automotive-grade chipsets offer robust computing, advanced AI, deep system integration, and industry-leading connectivity – while meeting the strict reliability standards required by automotive manufacturers.

    “Our partnership with Dirac represents an important step in delivering premium in-cabin experiences to the next generation of vehicles,” said Peter McCarthy, VP of Automotive Business, MediaTek. “By integrating Dirac’s advanced audio software directly into our automotive SoCs, we’re enabling carmakers to offer exceptional sound performance without the need for extensive additional hardware or customization. This collaboration brings scalable, high-quality audio solutions to market faster, while giving automakers the flexibility to differentiate through software innovation.”

  • Dirac and Black Sesame Technologies Partner to Advance Automotive Audio innovation

    Dirac and Black Sesame Technologies Partner to Advance Automotive Audio innovation

    Dirac, a Swedish leader in digital audio innovation, and Black Sesame Technologies, a top automotive-grade computing SoC provider, have joined forces to enhance in-car audio experiences. Through a newly signed Memorandum of Understanding (MOU), the companies aim to integrate Dirac’s advanced audio software into Black Sesame’s high-performance systems-on-chips (SoCs). This collaboration supports the growing demand for immersive, high-fidelity in-car audio, as consumers expect the same premium sound quality in their vehicles as they do in their homes.

    This partnership further strengthens Dirac’s footprint in the automotive market, particularly in China, where it already collaborates with industry giants like NIO, BYD, and Great Wall Motor. By working with Black Sesame Technologies, known for its SoC solutions powering autonomous driving and smart cockpit systems, Dirac expands its reach, offering OEMs a seamless way to deliver cutting-edge audio solutions. Together, the two companies are setting a new standard for software-defined automotive audio innovation.

    Swedish digital audio pioneer Dirac and Black Sesame Technologies, a Hong Kong listed leading automotive-grade computing SoC provider, today announced that the two companies have signed a Memorandum of Understanding (MOU) to explore the integration of Dirac’s market-leading digital audio software onto Black Sesame Technologies’ systems-on-chips (SoCs).

    “This partnership represents a strategic step for Dirac as it seeks to solidify its position as the world’s leading automotive audio provider. With China serving as a critical market for Dirac, this collaboration will further strengthen the company’s presence in the region, where it already partners with automotive industry leaders such as NIO, BYD and Great Wall Motor,” said Anders Storm, CEO, Dirac. “Dirac is dedicated to advancing the frontiers of digital audio in every application where sound matters – and Dirac-enabled SoC semiconductors represent a major growth opportunity for the company as well as our partners.”

    The demand for premium, immersive in-car audio is growing exponentially as more consumers expect the same audio experience in their cars as they enjoy in home listening environments. Dirac is building a new era of software-defined automotive audio by developing technologies that enable speakers to work in unison to maximize fidelity and create a clear, fully-immersive sound experience for every occupant.

    Dirac is an established leader in the automotive market, working with leading brands such as Volvo, Polestar, Genesis, NIO, and BYD, among many others. In recent years, Dirac has accelerated their automotive industry growth through partnerships with semiconductor and framework companies like NXP, Analog Devices, QNX, and now Black Sesame Technologies. With this agreement, Dirac continues to expand its footprint, making its solutions more accessible to OEMs worldwide.

    Black Sesame Technologies is a leading automotive-grade computing SoC and SoC-based intelligent vehicle solution provider. The company’s proprietary automotive-grade products and technologies empower intelligent vehicles with mission-critical capabilities, such as autonomous driving, smart cockpit, advanced imaging, and interconnection. Since its establishment, Black Sesame Technologies offers full-stack autonomous driving capabilities to meet broad customer needs through SoCs and SoC-based solutions, powered by their in-house developed IP cores, algorithms, and support software.

    Commenting on the MOU, which is the company’s first with a digital audio company, DING Ding, Vice President of Product, Black Sesame Technologies, said, “Black Sesame Technologies is dedicated to pioneering intelligent vehicle solutions and – with this memorandum – that now includes advancing the in-vehicle audio experience. Enabling our high-performance SoCs with Dirac’s digital audio solutions will provide our customers the option to seamlessly and efficiently equip their vehicles with the premium, immersive audio experience that their customers increasingly demand.”