Dirac and MediaTek Partner to Advance In-Car Audio Experiences Through Integrated Automotive Systems-on-Chips

Dirac has teamed up with global semiconductor leader MediaTek to enhance in-car audio by integrating Dirac’s advanced audio software into MediaTek’s automotive-grade chips. This partnership aims to help car manufacturers deliver high-quality, immersive sound more efficiently by reducing the need for complex hardware and simplifying system integration. The companies will showcase their initial collaboration at Auto Shanghai 2025, focusing first on MediaTek’s HiFi 5 DSPs in its Dimensity Auto Cockpit chipsets.

This move highlights the growing trend of software-defined audio systems in vehicles, offering OEMs faster time-to-market and scalable solutions. With Dirac already trusted by brands like Volvo and BYD, the partnership with MediaTek strengthens its reach in the automotive tech space, delivering next-gen cabin audio experiences that meet the rising consumer demand for premium in-car sound.

Swedish digital audio pioneer Dirac and global semiconductor leader MediaTek today announced a strategic collaboration to enhance in-car audio performance through the integration of Dirac’s industry-leading digital audio software into MediaTek’s automotive-grade systems-on-chips (SoCs).

The companies have signed a Memorandum of Understanding (MoU) to co-develop a proof of concept that integrates Dirac’s advanced audio optimization technologies directly onto MediaTek’s automotive platforms – enabling OEMs to deliver superior in-car sound quality with easier system integration and accelerated time-to-market.

“This collaboration with MediaTek is a key milestone in Dirac’s ongoing expansion in the automotive sector,” said Ramzi Khalaf, Director of Strategic Partnerships, Dirac. “By combining MediaTek’s powerful, energy-efficient chipsets with our proprietary audio technologies, we’re raising the bar for automotive sound performance. This partnership not only strengthens our global reach – it also reflects our commitment to future-ready hardware platforms that simplify integration and accelerate time to market for our customers.”

The initial phase of the collaboration focuses on integrating Dirac’s digital audio technologies into the HiFi 5 DSPs, featured in the MediaTek Dimensity Auto Cockpit chipsets designed for automotive applications. The companies will both attend the Auto Shanghai 2025, taking place April 25–May 2. This initiative marks the beginning of a broader, long-term strategic partnership.

As consumers increasingly expect high-fidelity, immersive sound inside vehicles—on par with premium home audio systems – automotive manufacturers are turning to software-defined solutions. Dirac is at the forefront of this shift, delivering technologies that maximize speaker performance and create consistent, high-quality sound for every seat in the cabin.

Dirac is an established leader in the automotive market, working with leading brands such as Volvo, Polestar, Genesis, NIO, and BYD, among many others. In recent years, Dirac has accelerated its automotive industry growth through partnerships with semiconductor and framework companies like NXP, Analog Devices, QNX, Black Sesame Technologies, and now MediaTek. With this agreement, Dirac continues to expand its footprint, making its solutions more accessible to OEMs worldwide.

MediaTek is a global innovator in SoC design, delivering high-performance, power-efficient semiconductors across automotive, mobile, home entertainment, and IoT. Its automotive-grade chipsets offer robust computing, advanced AI, deep system integration, and industry-leading connectivity – while meeting the strict reliability standards required by automotive manufacturers.

“Our partnership with Dirac represents an important step in delivering premium in-cabin experiences to the next generation of vehicles,” said Peter McCarthy, VP of Automotive Business, MediaTek. “By integrating Dirac’s advanced audio software directly into our automotive SoCs, we’re enabling carmakers to offer exceptional sound performance without the need for extensive additional hardware or customization. This collaboration brings scalable, high-quality audio solutions to market faster, while giving automakers the flexibility to differentiate through software innovation.”